Helping Outdoor LEDs Reduce Cost and Impact on the Environment

Example of Chip Scale Packaging Wafer

Chip Scale Packaging, also known as CSP, continues to change LEDs in a number of ways that could have profound ramifications for Bay Area municipalities and businesses. For instance, since CSP can be integrated into the wafer, it doesn’t expand the size of the LED packaging. In fact, it may even reduce the size because many CSPs eliminate the need for the wire bonding, sub-mount or lead frame.

Currently, CSP is most commonly found in high-power products, even though research suggests that it’s less efficient as a high-power package. The advent of CSP has also had a significant impact on LED street lighting. By reducing wafer size, CSP makes LED outdoor lighting cheaper and easier to install and maintain, and it reduces the environmental footprint.

In a 2014 keynote presentation at SIL, Samsung announced that the company’s CSP products would deliver performance benefits as well as cost reductions. Samsung also promised to maintain standards of baseline efficiency and lumen output with CSP technology and to add a larger overdrive range with more product variety.

By making outdoor LEDs smaller, more self-contained, and easier to produce, CSP technology may greatly improve the flexibility and durability of outdoor lighting, and the implications for businesses and cities are exciting. For instance, customers should be able to buy, install and maintain LED displays at reduced cost and also reduce related labor expenditures.

California and Nevada Outdoor Lighting Design Experts Ready to Assist

To explore your green outdoor lighting options, call the experts at Great Basin Lighting today at (925) 240-1566 (California) or (775) 333-0900 (Nevada).